Electronic Manufacturing

As a provider of electronic manufacturing services, EMS-ELECTRA produces complete electronic modules and products for industrial electronics, household appliances, consumer electronics, and medical devices.

Download General assembly conditions

Electronic Manufacturing - Industrial Production

SMD planting

Our equipment allows us to manufacture medium to high complexity products, which may include

- chips with dimensions of up to 0201
- integrated circuits in SOP, SSOP, QFP packages, with a minimum 0.4 mm pitch between terminal axes
- BGA components with ball diameters of at least 0.25 mm
- SMD components with a maximum size of 42 x 42 x 12 mm
- "Pin in paste" technology, for soldering through-hole components using solder paste SMD components are soldered using hot air reflow, with SAC305 solder paste (no-clean, halogen-free) or with the solder paste requested by the client.
All assembled electronic boards are inspected using an Automatic Optical Inspection (AOI) machine.

Electronic Manufacturing - Industrial Production

THT planting

The classic, through-hole components are manually assembled on the electronic boards.

The soldering of the components is made by single/double wave, selective or manual soldering, mostly using lead-free solder allow. At the request of the customer, the soldering with tin-lead alloy is also available. .

Electronic Manufacturing - Industrial Production

Final assembly

Final assembly services

Our final assembly services consist of:
- Microcontroller or memory programming (Microchip, Atmel etc.)
- Board testing by using in-house manufactured test stands or those provided by the customer
- Assembly of the mechanical parts, cables and boards
- Functional testing of the final product
- Product packaging for delivery/sale/export, including all the necessary accessories (user manual, power supply, cables etc.)

Electronic Manufacturing - Industrial Production

Testing

Full product testing

For comprehensive product tests, we have the ability to perform:
- AOI (automatic optical inspection) - done for all SMD assembled boards
- ICT (in-circuit testing): - Maximum 2000 testing points
- Limited capability of signal generation and wave analysis for integrated product functional testing.
- Functional testing
- The adaptors and testing devices for the product can be designed and produced in-house, within the ELECTRA Group of Companies.